Future Packaging Generations Benefit from Esko Donations

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Packaging engineering students across the USA will benefit from the latest Esko technology after the recent multi-million-dollar, in-kind donation underlined Esko’s continued commitment to supporting future generations of packaging industry workers, via new software upgrades & education partner license renewals.

Melissa Plemen, Esko Sr. Director of Inside Sales & Marketing, said the company was thrilled to continue supporting the education of next-generation packaging employees. “We believe it is just as important to also invest in those who represent the future of our industry. We have supported schools across the country in this way for a number of years, and we are delighted to again continue that support with this latest significant donation.”

More than 30 schools utilize Esko software, including: Appalachian State University, Clemson University, Cal Polytech State, Dunwoody College of Technology, Eastern Washington University, Illinois State, Indiana State University, Michigan State University, Rochester Institute of Technology, Ryerson University, University of Wisconsin – Stout and Virginia Tech.

To learn more about Esko technology solutions, visit www.esko.com.
 

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