Fujifilm’s Activ Hybrid LED-UV Curing System can be installed on new presses & retrofit to existing equipment by label & packaging converters. The new system combines the latest high-power, low-heat LED-UV curing technologies with Fujifilm's ink expertise to improve label production on narrow web presses; and enables traditional UV or water-based flexo presses to be seamlessly converted to LED-UV curing, for significant efficiencies.
The LED lamp system & Sericol Flexo JJ ink range have been developed in harmony for optimal performance. Employing a hybrid design, the system has the added benefit of conventional UV Arc capability: providing printers with the option of printing with specifically developed or unique conventional UV inks.
According to the company, the LED-UV Curing System offers significant cost & environmental benefits over conventional UV systems, including:
The LED lamp system & Sericol Flexo JJ ink range have been developed in harmony for optimal performance. Employing a hybrid design, the system has the added benefit of conventional UV Arc capability: providing printers with the option of printing with specifically developed or unique conventional UV inks.
According to the company, the LED-UV Curing System offers significant cost & environmental benefits over conventional UV systems, including:
- Drastically reduced Energy usage.
- Elimination of VOCs.
- Improved operator working environment, with many undesirable factors eliminated, including:
- heat from conventional UV lamps,
- noise & smell,
- reduced material usage,
- less maintenance & labor required.
- Increased productivity is another significant benefit. Press running speeds are 30-50% faster than a conventional UV system—to 120-170m/min—with the Activ System.
- Shorter job setups & make-ready times, due to improved substrate stability and the elimination of material distortion.
- Lower press down-time results in additional productivity gains.
- More consistent quality as heat from the UV lamps is removed—resulting in better registration & less substrate stretching.